As AI large language models continue to evolve, memory technology has gradually become a critical bottleneck restricting the performance of AI systems. At the 2026 Hot Chips conference, Micron Technology delved into the current state of high-bandwidth memory (HBM) development, highlighting that the AI industry is facing a severe 'memory wall' issue: computing power triples every two years, while HBM bandwidth growth remains less than twofold. This imbalance between computing power and memory bandwidth development is compelling the industry to seek more advanced packaging and processes to address thermal management challenges.