According to the latest AI Server industry research by TrendForce, driven by AI infrastructure development, AI chips from companies such as NVIDIA, AMD, and Google are continuously being upgraded. The thermal design power (TDP) of single chips generally exceeds 1kW, with the power consumption of entire-cabinet AI Server solutions rising to several hundred kW. Liquid cooling is gradually becoming a standard feature for high-end AI infrastructure. TrendForce forecasts that the penetration rate of liquid cooling in AI chips will reach 53% by 2026 and may approach 60% by 2027.