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Institutional Forecast: AI Chip Construction Boom to Trigger a Debt Issuance Peak Exceeding $500 Billion
2026-08-04 /
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Author：小编
On August 3, Citadel Securities latest forecast predicts that by 2028, the global public and private credit markets will see an increase of over $500 billion in debt to support the procurement of chips and facility construction for artificial intelligence data centers. Analysts state that this scale will exceed 5% of the total Bloomberg US Investment Grade Corporate Bond Index. Given the lifespan of chips, most of the bonds are expected to have maturities of 3 to 5 years, with some potentially being publicly offered through 144A private placements.
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