On August 3, Citadel Securities latest forecast predicts that by 2028, the global public and private credit markets will see an increase of over $500 billion in debt to support the procurement of chips and facility construction for artificial intelligence data centers. Analysts state that this scale will exceed 5% of the total Bloomberg US Investment Grade Corporate Bond Index. Given the lifespan of chips, most of the bonds are expected to have maturities of 3 to 5 years, with some potentially being publicly offered through 144A private placements.