As the AI chip race intensifies, sophisticated packaging has emerged as the linchpin for triumph, propelling a notable upswing in capital expenditures among OSAT (Outsourced Semiconductor Assembly and Test) companies. ASE Technology Holding, Powertech Technology, and King Yuan Electronics are projected to collectively invest a staggering NT$370 billion in capital expenditures this year. This figure not only sets a new benchmark but also represents the third consecutive year of record-breaking investment, underscoring the urgent need for advanced packaging solutions in the burgeoning AI chip sector.
