Capital Outlays of Three Leading OSAT Firms Soar to Record NT$370 Billion
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Author:小编   

As the AI chip race intensifies, sophisticated packaging has emerged as the linchpin for triumph, propelling a notable upswing in capital expenditures among OSAT (Outsourced Semiconductor Assembly and Test) companies. ASE Technology Holding, Powertech Technology, and King Yuan Electronics are projected to collectively invest a staggering NT$370 billion in capital expenditures this year. This figure not only sets a new benchmark but also represents the third consecutive year of record-breaking investment, underscoring the urgent need for advanced packaging solutions in the burgeoning AI chip sector.