Apple is ramping up its efforts in the realm of self-developed AI hardware, as it is currently testing an AI server chip, codenamed 'Baltra', which leverages cutting-edge glass substrates. This chip is anticipated to employ TSMC's state-of-the-art 3-nanometer N3E process and a chiplet architecture. Its research and development strategy adopts an 'island-style' closed model, a unique approach in the industry. Apple is considering procuring glass substrates directly from Samsung Electro-Mechanics. Meanwhile, Broadcom is tasked with developing the chip's communication components, while TSMC will oversee the final production and packaging processes. The utilization of glass substrates will replace traditional organic materials, providing benefits such as superior flatness and robust thermal stability. Samsung Electro-Mechanics has already launched a pilot line at its Cheonan-Sejong facility in South Chungcheong Province, with intentions to commence mass production post-2027. Media analysts speculate that Apple's strategic move is aimed at gaining greater control over packaging decisions and internalizing crucial technologies through a vertical integration approach.