On January 31, news emerged that the Administrative Committee of the Beijing Economic - Technological Development Area unveiled the Implementation Plan for Further Expediting the Construction of a City - Wide Artificial Intelligence Hub (2026 - 2027).

The plan sets out to bolster the fundamental capabilities for intelligent development from the ground up. It aims to capitalize on the region's strengths in integrated circuit manufacturing and foster an integrated development pattern encompassing 'design - manufacturing - packaging - testing - computing power'. This, in turn, is expected to drive upgrades in the computing power infrastructure and high - performance intelligent computing industries.

Simultaneously, the plan is geared towards promoting innovation in chip architectures, specifically focusing on digital - analog hybrid and in - memory computing. It also seeks to broaden the scope of industrial chains, including those related to scenario - defined chips and industry - specific chips.

Moreover, the plan places significant emphasis on facilitating the coordinated development of general - purpose and vertical models. It aims to accelerate the transition of cognitive models to proactive models. To solidify the 'chip - model adaptation' capabilities, the plan supports the establishment of national - level testing and validation centers for AI hardware and software, as well as large - model evaluation centers.

In addition, the area will actively roll out an AI security system. It will strive to make breakthroughs in technologies such as deepfake detection to ensure the security and trustworthiness of AI applications.