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Microsoft Inks Exclusive High Bandwidth Memory (HBM) Supply Deal with SK Hynix
1 week ago /
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Author：小编
Microsoft has recently entered into a substantial supply agreement with South Korean hardware giant SK Hynix. As per the terms of this deal, SK Hynix is set to become the sole provider of high bandwidth memory (HBM) chips for Microsoft's upcoming generation of AI accelerators.
The agreement clearly outlines that SK Hynix will supply HBM3e memory modules tailored for Microsoft's newest AI accelerator chip, the Maia 200. Each of these processors will incorporate six high-performance HBM3e chips. This entire hardware configuration has been meticulously crafted to manage extremely demanding AI workloads, with the whole card drawing around 750 watts of power.
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