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Microsoft Carves Microfluidic Channels into Silicon Wafers, Tripling Cooling Efficiency
1 week ago /
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Author：小编
Microsoft has installed hundreds of thousands of AI accelerators in its data centers. Such large-scale deployments can easily give rise to heat dissipation issues. To tackle this problem, Microsoft has introduced bespoke cooling plates, marking the first-ever application of microfluidic technology to silicon chips. By directly engraving micro liquid flow channels on the reverse side of the chips, the cooling fluid can effectively remove heat, thereby resolving the heat dissipation challenges associated with large-scale deployments.
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