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TSMC Speeds Up Advanced Packaging Capacity Expansion Through Partnership, Projected to Reduce CoWoS Capacity Shortfall to 10% This Year
2026-06-15 /
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Author：小编
TSMC is ramping up efforts to expand its advanced packaging capabilities. According to industry analysts, as TSMC and its partners gradually roll out new capacity, the current 20% gap between supply and demand for advanced packaging is expected to shrink notably to 10% this year. This development is set to pave the way for more seamless global shipments of AI chips. Looking ahead, the supply-demand balance is projected to see further enhancements by 2027.
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