Wu Sun Technology revealed on an interactive platform that the company is currently focusing on polymeric materials for MLCC dicing applications, including MLCC-cold peel tape and MLCC-thermal debonding/UV debonding tape. Among them, the MLCC-cold peel tape has secured orders from top clients, while the MLCC-UV debonding tape is in the stage of small-batch delivery. Currently, this business has not yet had a significant impact on the company's performance, and investors are reminded to be aware of the risks.
