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BOE A: The Yield of Glass Substrate Packaging Carrier Plate Pilot Line Has Not Yet Reached Mass Production Level
2026-06-04 /
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Author：小编
During institutional research, BOE A stated that the glass substrate packaging carrier plate pilot line, which the company invested 993 million yuan to build in 2024, has sent samples to some domestic customers. Some customers have passed conceptual certification and entered the technical testing phase. Currently, there is no mass production, no revenue from mass production has been achieved, and the yield of the pilot line has not reached the level required for mass production. It is uncertain when it will meet the standard.
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